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System on Package: Miniaturization of the Entire System
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System on Package: Miniaturization of the Entire System Hardcover - 2007 - 1st Edition

by Rao Tummala


From the publisher

Includes bibliographical references and index.

Details

  • Title System on Package: Miniaturization of the Entire System
  • Author Rao Tummala
  • Binding Hardcover
  • Edition number 1st
  • Edition 1
  • Pages 785
  • Volumes 1
  • Language ENG
  • Publisher McGraw-Hill Companies, New York
  • Date 2007-04-01
  • Illustrated Yes
  • Features Bibliography, Illustrated, Index, Table of Contents
  • ISBN 9780071459068 / 0071459065
  • Weight 3.08 lbs (1.40 kg)
  • Dimensions 9.3 x 7.6 x 1.4 in (23.62 x 19.30 x 3.56 cm)
  • Library of Congress subjects Microelectronic packaging, Multichip modules (Microelectronics) -
  • Library of Congress Catalog Number 2008016996
  • Dewey Decimal Code 621.381

About the author

Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.
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Introduction to System on Package: Miniaturization st 3
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Introduction to System-on-Package (SOP) Miniaturzation of the Entire System 2008   0-07-145906-5
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Introduction to System-on-Package (SOP) Miniaturzation of the Entire System 2008 0-07-145906-5

by R.R.TUMMALA

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