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System-In-Package RF Design and Applications
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System-In-Package RF Design and Applications Hardcover - 2006

by Michael P. Gaynor

In the past few years, System-in-Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. This comprehensive resource on SiP design techniques offers designers state-of-the-art packaging know-how.


Details

  • Title System-In-Package RF Design and Applications
  • Author Michael P. Gaynor
  • Binding Hardcover
  • Edition First
  • Pages 221
  • Volumes 1
  • Language ENG
  • Publisher Artech House Publishers
  • Date October 31, 2006
  • Illustrated Yes
  • Features Bibliography, Illustrated, Index, Table of Contents
  • ISBN 9781580539050 / 158053905X
  • Weight 0.99 lbs (0.45 kg)
  • Dimensions 9.24 x 6.26 x 0.68 in (23.47 x 15.90 x 1.73 cm)
  • Library of Congress subjects Multichip modules (Microelectronics) -, Radio frequency integrated circuits - Design
  • Dewey Decimal Code 621.381

Media reviews

Citations

  • Scitech Book News, 03/01/2007, Page 151
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System-in-Package RF Design and Applications
Stock Photo: Cover May Be Different

System-in-Package RF Design and Applications

by Michael P. Gaynor

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hardcover. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
Item Price
SGD 175.06
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