Description:
DEStech Publications, Inc., 2004. *Price HAS BEEN REDUCED by 10% until Monday, May 6 (weekend sale item)* 670 pp., Hardcover, new. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Stock Photo: Cover May Be Different
Thermal Conductivity 27/Thermal Expansion 15: Proceedings of the 27th International Thermal Conductivity Conference and the 15th International Thermal Hardcover -
by Hsin Wang (Editor)
Details
- Title Thermal Conductivity 27/Thermal Expansion 15: Proceedings of the 27th International Thermal Conductivity Conference and the 15th International Thermal
- Author Hsin Wang (Editor)
- Binding Hardcover
- Pages 670
- Volumes 1
- Language ENG
- Publisher Destech Publications
- Date 1
- Illustrated Yes
- ISBN 9781932078343 / 1932078347
- Library of Congress Catalog Number 2006281187
- Dewey Decimal Code 620.112
More Copies for Sale
Stock Photo: Cover May Be Different
Thermal Conductivity 27 / Thermal Expansion 15
by Wang, Hsin, Porter, Wallace
- Used
- Hardcover
- Condition
- Used
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9781932078343 / 1932078347
- Quantity Available
- 1
- Seller
-
Cleveland, Ohio, United States
- Item Price
-
SGD 62.56SGD 6.16 shipping to USA
Show Details
Item Price
SGD 62.56
SGD 6.16
shipping to USA