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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science) Paperback - 2010
by Springer
From the rear cover
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
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- Title Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)
- Author Springer
- Binding Paperback
- Edition Softcover reprin
- Language ENG
- Publisher Springer
- Date 2010-12
- ISBN 9783642077388
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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)
by M.R. Oliver (Editor)
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