Description:
Intercontinental Publishing Corp, 1985-01-01. 1St Edition. Hardcover. Good.
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High Tech Window to the Future Hardcover - 1985
by Bylinsky, Gene, O'Rear, Charles
Details
- Title High Tech Window to the Future
- Author Bylinsky, Gene, O'Rear, Charles
- Binding Hardcover
- Edition First Edition
- Pages 277
- Publisher n/a, Hong Kong
- Date 1985
- ISBN 9789622760011
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Silicon Valley High Tech : Window to the Future
by Gene Bylinsky
- Used
- good
- Hardcover
- Condition
- Used - Good
- Edition
- 1St Edition
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9789622760011 / 9622760015
- Quantity Available
- 1
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HOUSTON, Texas, United States
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SGD 24.91FREE shipping to USA
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High Tech: Window to the Future
by Bylinsky, Gene
- Used
- Condition
- Used - Very Good
- ISBN 10 / ISBN 13
- 9789622760011 / 9622760015
- Quantity Available
- 1
- Seller
-
Frederick, Maryland, United States
- Item Price
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SGD 54.00SGD 5.46 shipping to USA
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Description:
Intercontinental Publishing Corporation. Used - Very Good. Very Good condition. (Silicon Valley, Technology) NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES.
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SGD 54.00
SGD 5.46
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Silicon Valley High Tech : Window to the Future
by Bylinsky, Gene - Related Names: O'Rear, Charles; Bender, Lawrence
- Used
- Hardcover
- first
- Condition
- Used
- Edition
- First Edition
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9789622760011 / 9622760015
- Quantity Available
- 1
- Seller
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Galway, Ireland
- Item Price
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SGD 123.23SGD 39.64 shipping to USA
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Description:
Intercontinental Publishing Corporation Ltd. , Hong Kong, 1985. First Edition. Hardback. Near fine copy in the original title-blocked cloth with decorative integrated circuit attached to front panel. Slightest suggestion only of dust-dulling to the spine bands and panel edges. Remains particularly well-preserved overall; tight, bright, clean and strong. ; 277 pages; Description: p. 277. Subjects: New Technology - Silicon Valley - Microchips - Integrated circuits. Copiously illustrated in full, vibrant color.
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SGD 123.23
SGD 39.64
shipping to USA